Sony has said that the cooling fan in the PlayStation 5Â will be continually optimised through online patches.
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Yasuhiro Ootori, general manager of Sonyâs product design and hardware division, revealed the companyâs plans in a recent interview with 4Gamer. He said that the updates will be based on the consoleâs accelerated processing unit (APU), which has a temperature sensor onboard.
âVarious games will be released in the future, and data on the APUâs behaviour in each game will be collected,â he said, as translated by ResetEra user Orzkare and corroborated by Eurogamer. âWe have a plan to optimise the fan control based on this data.â
Ootori previously hosted Sonyâs teardown video for the PS5, where he showcased the systemâs double-sided cooling fan, alongside a large heat sink. During the teardown, he also revealed that, in addition to the APUâs temperature sensor, the console will also feature three more sensors on the main board.
Last week, Ootori said that the PS5âs overall size was largely due to the systemâs double-sided cooling fan. âIt was possible to develop the PlayStation 5 to be smaller. For example, by implementing two cooling fans, one for side A and side B, the PlayStation 5 size would have been reduced,â Ootori told Xtech, as translated by VGC.
However, he also noted that it would have increased the cost of the system, and made it more difficult to control the systemâs overall cooling ability. âWith these additional obstacles in mind, we decided to cool both sides of the main board with one, large fan,â he added.
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